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Wafer Grinding & Dicing Company San Jose, CA

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    If you're interested in learning more about the benefits of grinding and dicing services, read on. We will examine the Company's history, current sales, and employees. You'll also discover how dicing has helped the Company for 25 years. Interested?

    Benefits of grinding & dicing services

    Outsourcing grinding and dicing services can reduce your costs, time, and effort while still providing a high-quality product. GDSI dicing services are the premier source of grinding and dicing services for electronic manufacturers in the northern and silicon valley areas. They provide high-quality products at competitive prices, and are highly reliable. Read on to discover more about how outsourcing grinding and dicing services can help your business.

    GDS has a business credit rating. This is a critical indicator of a reliable company that has met its obligations. Their report includes their latest credit limit, ownership structure, and any court judgments. This information helps you select the best prospective customer for your business. A reliable company will be able to satisfy a wide variety of customer needs. And since it's a niche industry, there's a high possibility that their products will meet your standards.

    The most popular process for processing thin wafers is DBG. This process guarantees zero wafer breakage. DBG begins with a half-cut Dicing step, followed by back grinding to reach the groove. Dicing before grinding is also recommended as it ensures zero edge chipping and perfect backside quality. A company can offer multiple processing options, including grinding. To learn more about DBG, click below.

    Plasma dicing is another common post-grinding process. It reduces chipping, cracking, and warpage in silicon, and increases the reliability of devices exposed to external stress. Plasma dicing can be performed before or after grinding, which gives you flexibility to schedule a grinding session that suits your schedule. In addition, plasma dicing services can even handle the removal of SOI wafers.

    Stealth Dicing has been providing dicing services for more than 25 years

    The quality and efficiency of the grinding and dicing services offered by Stealth Dicing have made them the preferred choice of electronics manufacturers. The company specializes in a wide range of dicing services, including bare-die dicing, back grinding, pick and place, polishing, etching, and more. The company also offers same-day service, automated pick and place, and consulting services on mask layout.

    The company employs 24 employees at its headquarters in San Jose, California. Revenue is estimated at $7.82 million, however actual sales may be different. The average sales price is based on the manufacturing costs of electronic hardware. This statistic is important because it represents actual contacts with the company. This information is also accurate, as GDSI has been providing grinding and dicing services for over 25 years.

    If you need to have a large number of mems diced or polished, Stealth Dicing can provide the services you need. The company also offers customized service solutions to meet the needs of various industries. Our cutting solutions are used to improve IC packaging and make it easier to develop portable electronics. The company is committed to exploring new applications, achieving maximum product yield, and minimizing unit costs.

    Stealth laser dicing is water and particle-free. It is highly compatible with most semiconductor materials and has excellent mechanical properties. It is particularly suited for bio-sensor and quantum devices. Additionally, the process is safe for sensitive components. In addition, the laser dicing process doesn't require sub-dicing the wafer. It is ideal for IC packaging and is a safe choice for high-precision dicing.

    Company's current sales

    Stealth Dicing is a manufacturing company located in San Jose, California, United States. It is a part of the Semiconductor and Other Electronic Component Manufacturing Industry. The Company currently has 24 employees and generates $7.82 million in revenue annually. You can research companies by using D&B Hoovers, which is backed by Dun & Bradstreet's Data Cloud. By using D&B Hoovers, you can quickly and easily prioritize your prospects.

    Today's semiconductor device manufacturing industry is increasingly complex, requiring advanced technologies in processing thin wafers. With the increasing complexity of semiconductor dies, the dicing process is becoming a critical competency for many device manufacturers. DISCO provides complete solutions that include machine, grinding wheel, protective tape, and processing conditions. The Company has focused on developing laser dicing technology and has made it a pillar of its business. This technology is fast-growing and can cut both thin and thick silicon.

    Employees

    If you're looking for a top wafer dicing service, you've probably come across Stealth Dicing in San Jose, CA. This specialized company is headquartered in San Jose and has 24 employees. Their payroll expenses in 2019 will be over $1.8 million. These numbers are based on a national average, which is important because the actual figures could differ slightly. The average sales price is based on the cost of manufacturing electronic hardware.

    You can obtain a free credit report for Stealth Dicing, located at 925 Berryessa Rd in San Jose, CA. The company has a score of B-. This indicates that it's a reputable company with a high credit limit. Your report will also contain information on ownership, group structure, and court judgments. The company may be listed as an active business, but you can also get a free credit report for seven days to see whether it's a good investment.