PCB with Isola 370HR Material


The demands relating to the reliability of printed circuit boards are increasing. Major influences besides the actual layout and design are the thermal attributes of the base material such as the glass transition temperature (Tg), time to delamination at 260 °C (T260) and 288 °C (T288) thermal decomposition temperature (TD) and the thermal expansion behaviour in the z-axis. In many cases the reliability of printed circuit boards is determined by destructive tests, especially in automobile applications.To get more news about [url=https://www.pcbmake.com/fr4-isola-370hr-pcb/]Isola 370HR PCB[/url], you can visit pcbmake official website.

Specifications:
Material: Isola 370HR
Layer count: 16 layers
Board thickness: 3.5mm
Copper thickness: 1oz
Minimum drill size: 0.1mm
Minimum trace & gap: 0.1mm
Surface finish: hard gold plating
Special Technology: Blind and buried via
Applications: ATE (Automatic Test Equipment)
PCB Capabilities:
Rigid PCB up to 30 layers
Flexible PCB up to 6 layers
Rigid flex PCB up to 20 layers
Metal based PCB up to 8 layers
Material used: FR4, High TG FR4, Halogen free FR4, High frequency, Ceramic, Aluminum or Copper based, Polyimide, PTFE Hybrid
Surface finish: HAL, lead free HAL, immersion gold, silver, tin, OSP, hard gold plating, ENEPIG, carbon ink, blue mask
DHI technology: 1+n+1,1+1+n+1+1,2+n+2，3+n+3, stacked vias available
Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), Via in PAD filling, extreme large or thick PCB, Microwave & RF Circuit Boards